semiconductor verification

Failure Analysis

Based on continuous evolution of IC designs and manufacturing processes, (Failure Analysis) for integrated circuit device abnormalities has become more important and difficult. Therefore, in the field of modern IC failure analysis, how to locate and analyze failures in tens of thousands of transistors quickly and accurately has become an important issue to improve chip quality.  。
 
VESP Technology Corp provides EFA (electrical failure analysis) and PFA (physical failure analysis) resources and equipment required to improve IC failure analysis. Facing several failure modes, our failure analysis experts have profound experiences and insight capacity that can develop efficient failure analysis processes for customers and provide professional failure analyses and diagnosis reports.
Well-equipped
Custom service
Professional diagnosis
IC Verification Methodologies & Flow
 

 

Service Items
 
Non-destructive:
1
Scanning Acoustic Tomography (SAT) MORE
2
X-ray inspection (X-ray) MORE
Electrical Failure Analysis:
1
InGaAs microscope (InGaAs) MORE
2
Optical Beam Induced Resistance Change (OBIRCH) MORE
3
Thermal EMMI (Thermal EMMI) MORE
Physical Failure Analysis:
1
Laser/Decap (Decap) MORE
2
IC Delayer (Delayer) MORE
3
Cross-section (Cross-section) MORE
4
Cross Section Polisher (CP) (CP) MORE
5
Scanning Electron Microscope (SEM) & EDS MORE

Customer Service

TEL:+886-3-666700 ext. 6272,6274

Mail:fa@vesp-tech.com


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