Laser/Decap

During IC failure analysis, it is necessary to analyze the internal obstruction due to the packaging colloid. Remove the black glue with laser and chemical etching and expose the internal packaged wafer in order to make visual inspection or subsequent analysis of the wafer.

Application Scenario

• Easy to observe 2nd solder joint
• More accurate hole opened
• Multiple holes opened

​Equipment Capacity

​Case Study

Customer Service

TEL：03-6669700 ext. 6272,6274

Mail：fa_tw@vesp-tech.com