semiconductor verification

Cross Section Polisher (CP)

Cross Section Polisher (CP)

Ion beam cross-section grinding / chemical polishing (CP) is a technology applied to ion beams.It can be used for longitudinal grinding of samples and horizontal polishing.The advantage of applying ion beam is that it will not be affected by the stress or pull caused by manual grinding. Sample structure is broken or result in fuzzy interface.

Application Scenario

  • Glass, ceramics and other materials
  • Packaging samples can be directly observed by SEM after grinding by ion beam without further treatmen

 Equipment Capacity

Case Study

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