semiconductor verification


IC Delayer

IC Delayer, remove metal and oxide with dry, wet etching and horizontal grinding methods. It can use optical or electron microscope to check whether there is any abnormality.

Application Scenario

  • Remove metal occurred in wafer Al and Cu process
  • PCB lapping
  • Sample horizontal inspection

​Equipment Capacity

Case Study

Customer Service

TEL:03-6669700 ext. 6272,6274

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Hello, if you have any questions or suggestions for us, please call + 886-3-666-9700 # 9 or leave a message on the form below and we will reply you as soon as possible, thank you!
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