semiconductor verification



Traditional cross-section grinding grinds the sample cross-section with sandpaper, and polish it to complete the sample preparation. Observe the structure distribution and defect inspection through optical or electron microscope.

Application Scenario

  • Defect position / range observation on packaging or wafer (delamination, void, crack, etc.).
  • Sample longitudinal observation

​Equipment Capacity


Customer Service

TEL:03-6669700 ext. 6272,6274


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